LOAD BOARD
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Load Board Online Inquiry
Competitive Advantage Factors
1. The most innovative Design Rule based on SI/PI Simulation
- Via impedance control with extensive design libraries
- Low power impedance design for the best dynamic performance
2. The most advanced Fab technology for PCB manufacturing
Technology
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SI & PI Simulation based PCB design
DFM based layout
Signal integrity : S-parameter, TDR and eye diagram
Power integrity : Power Impedance(PI), IR drop, DCR check
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High Speed Test Interface Technology
32Gbps or higher HSIO Design using TSE Loopback component (TL4C2-40x/50x/60x)
Target Via Impedance Implementation Tech
IL estimation technology
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Lower Power Integrity Technology
Lower inductance implementation technology considering Plane, Via, Return path, Cap ESL, etc.
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Ultra Fine Pitch Interface Technology
0.3mm BGA ultra fine pitch & Back drill
Back-drill stub 0.15±0.1mm
Load Board Line up
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U-Flex XD
DUT Count : 1375FCFBGA 4Para
Size : 580 x 404mm
Thickness : 6.35mm+/-0.2mm
Material : I-Tera
Layer : 54Layer
Option : HPL/BVH/Back-drill/0.35P
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T2000 EPP
DUT Count : 1292FCFBGA 16Para
Size : 680 x 520mm
Thickness : 6.35mm+/-0.2mm
Material : FR-4
Layer : 60Layer
Option : HPL/BVH/0.4P/Back-drill
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V93K
DUT Count : 724BGA 4Para
Size : 581 x 429mm
Thickness : 7.2mm+/-0.2mm
Material : Meteorwave2000
Layer : 46Layer
Option : HPL/Back-drill
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T2000
DUT Count : 100FCFBGA 16Para
Size : 550 x 480mm
Thickness : 4.8mm+/-0.2mm
Material : FR-4
Layer : 30Layer
Option : HPL/0.4P/Back-drill
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V93K DD
DUT Count : 12Para(9025BGA)
Size : 581 x 429mm
Thickness : 7.6mm+/-0.2mm
Material : I-Tera
Layer : 58Layer
Option : HPL/Back-drill
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U-Flex
DUT Count : 748FCMSP 8Para
Size : 580 x 404mm
Thickness : 4.8mm+/-0.2mm
Material : FR-4
Layer : 46Layer
Option : HPL/0.4P/Back-drill
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U-Flex DD
DUT Count : 2Para(5742BGA)
Size : 404 x 404mm
Thickness : 7.5mm+/-0.2mm
Material : I-Tera
Layer : 26Layer
Option : HPL/Back-drill
Specification
| Pitch(mm) | 0.5 pitch | 0.4 pitch | 0.35 pitch | 0.3 pitch | ||||||||
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| Class | Standard | Advanced | Eng. | Standard | Advanced | Eng. | Standard | Advanced | Eng. | Standard | Advanced | Eng. |
| Thickness(mm) | 4.8 | 6.35 | 7.4 | 4.2 | 5.0 | 6.35 | 3.2 | 4.0 | 5.2 | 2.0 | 3.4 | 3.8 |
| Aspect Ratio | 24 | 32 | 37 | 28 | 33 | 42 | 26 | 32 | 42 | 20 | 32 | 36 |
| Back Drilling Depth | 5.5mm | 4.5mm | 3.5mm | 3.0mm | ||||||||
| Back Drilling Stub | 0.05mm ~ 0.25mm (0.15 ± 0.1mm) | |||||||||||
| Max Board Thickness | Standard 6.35mm, Advanced 7.4mm, Engineering 8mm | |||||||||||
High Speed IO Lookback Component for PCIe Gen6 & up to 128Gbps PAM4
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Superior signal integrity and RF performance
Replaceable 2 mechanical relay
Semi-permanent lifespan
Possible to select 85Ω or 100Ω differential
company news
- Directions
- Headquarters (2nd Plant) 3rd plant MEMS Fab
TSE / 189, Gunsu 1-gil Jiksan-eup Seobuk-gu, Cheonan-si Chungcheongnam-do, Korea (213-15 Gunseo-ri) / TEL. +82 41-581-9955
(C) TSE Co., Ltd.
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