DSA INTERFACE SOLUTION
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Shorter delivery DSA Interface solution Online Inquiry
Key Features
| Test Device | DDR4, DDR5, LPDDR4, LPDDR5, GDDR5, GDDR6, NAND FLASH, MCP, UFS, S5E, etc. |
| High Speed Signal Integrity capability | Up to 24Gbps |
| Low power Integrity capability | Low Impedance & IR Drop |
| Fine pitch PCB Design & manufacturing capability | Up to 0.2mm pitch |
| High parallelism expansion capability | Up to 960para |
Testing memory semiconductors such as Mobile DRAM, PC DRAM, Graphic DRAM, and UFS, which are high-capacity and high-speed, requires a test interface solution with advanced technology.
TSE's interface solution supports high speed, low noise, and stable signal transmit characteristics, especially the convergence of Fine Pitch PCB technologies provides higher value through the implementation of High Parallelism to improve Test Speed and productivity.
Product Line-up
| Magnum EPIC DSA | Magnum V(UPBX) DSA | Magnum V(UPBY) DSA |
|---|---|---|
| LPDDR4/4X/5, GDDR6 | NAND FLASH, UFS, S5E | UFS4.0, S6E |
| Up to 9Gbps | Up to 16Gbps (Digital Ch. 1.6Gbps) |
Up to 23.4Gbps (Digital Ch. 1.6Gbps) |
| Up to 512para (TW-350HT, STH5700) |
Up to 768para (TW-350HT, TW-S7, STH5xxx, M550HT) |
Up to 768para (TW-350HT, TW-S7, STH5xxx) |
| Magnum 7 DSA | T5503HS DSA | T5832/T5833 DSA |
| NAND FLASH, LPDDR5 | DDR4, LPDDR4/4X | NAND FLASH, DDR4, LPDDR4 |
| Up to 5Gbps | Up to 4.5Gbps | Up to 2.8Gbps (2.4Gbps @ T5833) |
| Up to 384para (TW-350HT, TW-S7, STH5xxx) |
Up to 512para (M6242, STH5700) |
Up to 768para (M6242, STH5700) |
company news
- Directions
- Headquarters (2nd Plant) 3rd plant MEMS Fab
TSE / 189, Gunsu 1-gil Jiksan-eup Seobuk-gu, Cheonan-si Chungcheongnam-do, Korea (213-15 Gunseo-ri) / TEL. +82 41-581-9955
(C) TSE Co., Ltd.
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