Test Interface Board Technology

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  SI & PI Simulation based PCB design

  DFM Based layout

  Signal and power integrity : S-parameter, TDR and eye diagram

  Power plane analysis : Z-parameter

  IR drop check

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  TRE (Test Resource Enhancement Technology)

  High speed and high parallel by using test interface board with unique TSE’s TRE technology onto existing ATE facility.

  Development Experience - Application : FPGA, XOR, FOB, Power Boost Module

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  High Parallel Interface Technology

  Perfect high parallel interface technology to maximize customer test productivity.

  Development Experience - Up to 960Para

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  High Speed Test Interface Technology

  High speed and high performance memory device test with TSE advanced high-speed interface integration technology.

  Development Experience - Up to 20Gbps

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  Ultra Fine Pitch Interface Technology

  Multi layer, ultra fine pitch product through prior technology development for PCB design & Fab.

  Development Experience - Up to 0.2mm

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  Extreme Temperature Interface Technology

  Test Interface Solution for extreme temperature environments.
  
  - Automotive
  - Military
  - Medical