Probe Card Technology

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  Ceramic substrate fabrication STC Space Transformer Ceramic

  TSE owned technology as HTCC

  Short Lead Time

  High quality with high strength

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  Polyimide multi layers

  Excellent solution for high performance SI

  High Para. Solution with Channel sharing

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  PCB design SI & PI simulation

  SI : Optimization SI for the shared signals

  PI : Optimization PI as <0,5 Ω, 1MHz~100MHz

  Power & GND layer optimization

  Decoupling capacitor tuning

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  High Para. Utilizing FPGA & switching IC

  Switching IC for signal sharing

  PMIC, HVIC for power sharing

  FPGA Controlling

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  MEMS probe Design and fabrication

  High reliability performance

  Various customers’ applications

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  STO-ML

  Space transformer PCB between PLB and probe head

  HDI(High Density Interconnection)