FAQ

Low dielectric, low-loss materials satisfying high-speed signal transmission

characteristics are used.

Optimal materials are applied on the basis of our various development

experiences, including the Hybrid Board which feature a combination of

materials suitable for Signal Integrity and Power Integrity

TSE guerantees operation temperation from -55°C to 125°C for standard product.

In case of product like automotive which requires higher temperature endurance from -55°C to 150°C ,TSE can develop and provide Thermal Solution Test Interface Board.

We need detailed information of review items such as the Tester and

Infra to be applied.

If you leave any questions about products on our website, we will be

happy to answer your questions.

We have developed High-Speed, High-Current and High-Count universal

interface boards using various interconnection solutions.

We need more details to develop fine pitch board.

Please contact us through website with required specificaton and 

we will sincerely reply it.

We are able to develop STO-ML (Space Transformer Organic-Multi Layer).

Please contact us through website with required specificaton and 

we will sincerely reply it.

We are working on simulation-based design.

We use 2.5D and 3D electromagnetic analysis tool to guarantee our 

SI/PI PCB design quality.

We also go through the mechanical design verification steps using 

thermal/mechanical analysis to design products that meets customer 

specifications in advance.