Fine pitch up to 50µm
Co-Planarity : C4 Area : ≤25um, Edge of STO: ≤50um
Capable Thin PI Film 5 layers
Pad Finish : Electro Au plating Ni 3um, Au 1.5um
STO_ML | FAB Capability | |
---|---|---|
Layer | Build-up | Thin Film |
14+N+14 | 3 | |
Pitch(um) | 100 | 50 |
Line / Space(um) | 20 / 20 | 15 / 15 |
Thickness (mm) | 3.2 | 0.09 |
Board Size (mm) | 75 x 75 |