Memory Probe Card

  • Shorter delivery STC Space Transformer Ceramic Online Inquiry    

    Key benefits

    TSE ceramic substrate solution

    More than 40,000 pin counts

    Low cost for design and tooling

    Delivery : NPI 6 weeks, reorder 4 weeks

  • High performance Polyimide multi-layer Online Inquiry    

    Key benefits

    STC-ML, LTCC-ML

    Higher density and the shorter trace length

    Polyimide layers : 2~11

    Signal quality improvement with channel sharing

    Max. 1.8GHz@-3dB for IO

    <150ps tPD skew for CLK

  • Various sharing technologies High parallel for Flash Online Inquiry    

    Key benefits

    The SI guaranteed up to 12 shared channels

    Dual power with PMIC application

    High speed relay IC (125MHz)

    <250ps tPD skew for 12 shared Channels

    Up to 14,000 switches

    Various ASIC (FPGA & switching IC)

    PMIC, PWIC, HSIC, HVIC for power & signal sharing

  • Small pad pitch & high pin count application High Performance for DRAM Online Inquiry    

    Key benefits

    Shortest probe length

    Thinnest probe thickness

    Finniest pitch micro bonding

    Highest pin count

    16 shared channels with multi layer PI

    Pitch : Min. 57㎛

    Pin count : 100,000 pins

    Power integrity : 0.5Ω @ <100MHz

    Frequency : 125MHz

  • Temperature control on ceramic High Performance Online Inquiry    

    Key benefits

    Heater Application

    Wider pad margin for higher temp

    Heater range : 20℃~125℃

    Wider operating temp.: -55℃~125℃


    Low CTE Substrate

    Single temp. application with CTE 0.7ppm

    Small Pad size application

    Shorter pre-heating time

    Guarantee the first wafer contact margin


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