TSE ceramic substrate solution
More than 40,000 pin counts
Low cost for design and tooling
Delivery : NPI 6 weeks, reorder 4 weeks
STC-ML, LTCC-ML
Higher density and the shorter trace length
Polyimide layers : 2~11
Signal quality improvement with channel sharing
Max. 1.8GHz@-3dB for IO
<150ps tPD skew for CLK
The SI guaranteed up to 12 shared channels
Dual power with PMIC application
High speed relay IC (125MHz)
<250ps tPD skew for 12 shared Channels
Up to 14,000 switches
Various ASIC (FPGA & switching IC)
PMIC, PWIC, HSIC, HVIC for power & signal sharing
Shortest probe length
Thinnest probe thickness
Finniest pitch micro bonding
Highest pin count
16 shared channels with multi layer PI
Pitch : Min. 57㎛
Pin count : 100,000 pins
Power integrity : 0.5Ω @ <100MHz
Frequency : 125MHz
Wider pad margin for higher temp
Heater range : 20℃~125℃
Wider operating temp.: -55℃~125℃
Single temp. application with CTE 0.7ppm
Small Pad size application
Shorter pre-heating time
Guarantee the first wafer contact margin