SoC Probe Card
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High Electrical performance VPC Vertical Probe Card Online Inquiry
Key benefits
MEMS Technology low contact force and High CCC Probe
Assemble up to 30K probe head
Direct docking solutions (V93K, Uflex, T2000)
| Mems Probe | Probing for Cu-Pillar Bumps | Probing for AL Pads | |||
|---|---|---|---|---|---|
| Min Pitch (Full Array) | ≥110 µm | ≥90 µm | ≥50 um | ≥90 µm | ≥50 µm |
| Probe name | VW150H | VW90 | VW50 | VW90P | VW50P |
| Tip Size (µm) | 70 x 40 | 55 x 55 | 25 x 25 | 55 x 55 Pointed Tip : 5~8 µm |
25 x 25 Pointed tip : 5~8 µm |
| Force @3mils OT | 3.5±0.7g | 2±0.4g | 1.5±0.3g | 3±0.6g | 2±0.4g |
| CCC (ISMI 2009) | ≥1.5A | ≥1.5A | ≥450 mA | ≥1.1A | ≥450 mA |
company news
- Directions
- Headquarters (2nd Plant) 3rd plant MEMS Fab
TSE / 189, Gunsu 1-gil Jiksan-eup Seobuk-gu, Cheonan-si Chungcheongnam-do, Korea (213-15 Gunseo-ri) / TEL. +82 41-581-9955
(C) TSE Co., Ltd.
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