RF Test System

TP9000 Prober

Prober System

  • Sensitivity WLCSP Chip Probing System _ RF Chip
  • Wafer to Wafer Loading / Unloading
  • Top Contact & High Speed System

Specification

Type Wafer
Max. Inch 4~6 Inch(Option)
Resolution ±15um
Die Size 8 mil x 8mil to 50 mil x50 mil
Index Time 95ms

TP9000P Taping

Taping System

  • Accurate Vision Taping System
  • Top/Bottom Vision Crack Detection( Option_Side)
  • Crack , Chipping , Bow Detection
  • For Chip & PKG

Specification

Type Wafer
Max. Inch 4 Inch(Option)
Resolution ±38um
Device 500*500um~1600*1600um
System Rotation ±3°

LVS9000 Vision Sorter

Sorting System

  • Laser Diode Vision Sorter
  • Turret Site Vision Detection
  • Drag Picking System

Specification

Type Bar
Rotation Type Turret
Die Rotation ±3°
X,Y Placement ±30um
Device 200*300um~300*1,000um

제품문의

문의하고자 하는 내용이 있으시면, 아래 양식을 통해 접수하여 주시기 바랍니다.
고객 여러분의 문의사항을 적극 반영할 수 있도록 노력하겠습니다.