MRC (MEMS Rubber Contact)
- Using the MEMS process to produce powder with uniform shape and size
- Supporting fabrication/application of desired powder shape for the MEMS process
- Applying Powder with a Docking structure that can support inter-power bonding
- Improved plating properties by improving uniform shape and surface roughness
- Improved electrical properties by improving plating properties
|Contact PAD||Solder Ball|
|Contact Resistance||< 100mΩ|
|Contact Force||<10gf and depend on customer requirement|
|Current Capacity||Max. 3.0A|
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