MRC (MEMS Rubber Contact)

  • Using the MEMS process to produce powder with uniform shape and size
  • Supporting fabrication/application of desired powder shape for the MEMS process
  • Applying Powder with a Docking structure that can support inter-power bonding
  • Improved plating properties by improving uniform shape and surface roughness
  • Improved electrical properties by improving plating properties


Item MRC
Contact PAD Solder Ball
Contact Resistance < 100mΩ
Pitch > 200㎛
Band Width >67Ghz@-1dB(S21)
Contact Force <10gf and depend on customer requirement
Current Capacity Max. 3.0A

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