Standard Interface Solution
High Speed & High Parallelism Interface Solution
It is necessary to have a test interface solution with advanced technology in order to test high-capacity and high-speed memory semiconductors such as Mobile DRAM, PC DRAM, Graphic DRAM and UFS.
TSE’s interface solution supports High Speed, Low Noise and stable signal transmission characteristics. In particular, technology convergence using Fine Pitch PCB solution provides higher value by implementing High Parallelism for the improvement of test speed and productivity.
|Test Device||DDR3, DDR4, LPDDR3, LPDDR4, LPDDR4X, GDDR5, UFS, GDDR6|
|Parallelism||Up to 960 DUTs|
|Ball Pitch||Up to 0.2mm Pitch|
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